ROHM Semiconductor · Other integrated circuits
BU1850MUV-E2
IC XPNDR 400KHZ I2C 35VB
A multi-brand MCU and embedded-component workspace. Compare recorded cores, memory, interfaces and packages while retaining firmware, board and manufacturer constraints.
Request this exact part →
BU1850MUV-E2 specifications
Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.
| Manufacturer | ROHM Semiconductor |
|---|---|
| Ordering code | BU1850MUV-E2 |
| Family | Other integrated circuits |
| Package | 16-VFQFN Exposed Pad |
| Product Status | Not For New Designs |
| DigiKey Programmable | Not Verified |
| Number of I/O | 8 |
| Interface | I²C |
| Interrupt Output | Yes |
| Features | POR |
| Output Type | Open Drain |
| Current - Output Source/Sink | Not provided in source |
| Clock Frequency | 400 kHz |
| Voltage - Supply | 1.65V ~ 3.6V |
| Operating Temperature | -30°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 16-VFQFN Exposed Pad |
| Supplier Device Package | VQFN016V3030 |
Documents and evidence
Request exact-model documentation with your inquiry.
Before sourcing BU1850MUV-E2
- Start from engineering requirements
- Record toolchain and firmware dependencies
- Verify package, pinout and peripherals
- Approve alternatives before procurement
Questions about BU1850MUV-E2
How do I request a current price?
Provide this full code, quantity, destination and arrival date. Budget estimates are conditional; final availability and price are confirmed by quotation.
Can a related record replace this device?
Related records aid discovery. Package, pinout, ratings, tooling and software require engineering approval before substitution.
Continue your Other integrated circuits review
BA12003B16-DIP (0.300", 7.62mm)
BA12003BF-E216-SOIC (0.173", 4.40mm Width)
BA12003DF-ZE216-SOIC (0.173", 4.40mm Width)
BA12004DF-ZE216-SOIC (0.173", 4.40mm Width)
BA5825FP-E2-
BA5834FM-E2-