TDK InvenSense · Development boards
EV_MOD_CH101-01-02
CHIRP EVALUATION MODULE CH101
A multi-brand MCU and embedded-component workspace. Compare recorded cores, memory, interfaces and packages while retaining firmware, board and manufacturer constraints.
Request this exact part →EV_MOD_CH101-01-02 specifications
Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.
| Manufacturer | TDK InvenSense |
|---|---|
| Ordering code | EV_MOD_CH101-01-02 |
| Family | Development boards |
| Package | Not recorded |
| Product Status | Active |
| Sensor Type | Ultrasonic, 3D Time-of-Flight (ToF) |
| Sensing Range | 4cm ~ 1.2m |
| Interface | I2C |
| Sensitivity | Not provided in source |
| Voltage - Supply | 1.62V ~ 1.98V |
| Embedded | Not provided in source |
| Supplied Contents | Board(s) |
| Utilized IC / Part | CH101 |
Documents and evidence
EV_MOD_CH101-01-02 ↗Before sourcing EV_MOD_CH101-01-02
- Start from engineering requirements
- Record toolchain and firmware dependencies
- Verify package, pinout and peripherals
- Approve alternatives before procurement
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