LIANYIXIN · INDEPENDENT COMPONENT STORE
English / USD quote

Home / Model directory / LPC5502JBD64E

NXP Semiconductors · NXP

LPC5502JBD64E

IC MCU 32BIT 64KB FLASH 64HTQFP

A multi-brand MCU and embedded-component workspace. Compare recorded cores, memory, interfaces and packages while retaining firmware, board and manufacturer constraints.

Request this exact part →
LPC5502JBD64E component illustration
Component illustration · verify actual package in documentation.

LPC5502JBD64E specifications

Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.

ManufacturerNXP Semiconductors
Ordering codeLPC5502JBD64E
FamilyNXP
Package64-TQFP Exposed Pad
Product StatusActive
DigiKey ProgrammableNot Verified
Core ProcessorARM® Cortex®-M33
Core Size32-Bit Single-Core
Speed96MHz
ConnectivityCANbus, Flex COMM, I²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O45
Program Memory Size64KB (64K x 8)
Program Memory TypeFLASH
EEPROM SizeNot provided in source
RAM Size48K x 8
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
Data ConvertersA/D 9x16b SAR
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case64-TQFP Exposed Pad
Supplier Device Package64-HTQFP (10x10)

Documents and evidence

LPC5502JBD64E ↗

Catalog sources

www.ic-components.com · LPC5502JBD64E ↗

Source directory identity match; source detail pending. Specifications remain from existing catalog.

Before sourcing LPC5502JBD64E

  1. Start from engineering requirements
  2. Record toolchain and firmware dependencies
  3. Verify package, pinout and peripherals
  4. Approve alternatives before procurement
Embedded Design Matcher →

Questions about LPC5502JBD64E

How do I request a current price?

Provide this full code, quantity, destination and arrival date. Budget estimates are conditional; final availability and price are confirmed by quotation.

Can a related record replace this device?

Related records aid discovery. Package, pinout, ratings, tooling and software require engineering approval before substitution.

Continue your NXP review

A7001AGHN1/T1AG315 illustrationA7001AGHN1/T1AG31532-VFQFN Exposed PadA7001CGHN1/T1AGAEL illustrationA7001CGHN1/T1AGAEL32-VFQFN Exposed PadA7001CGHN1/T1AGBEL illustrationA7001CGHN1/T1AGBEL32-VFQFN Exposed PadA7001CGHN1/T1AGBWJ illustrationA7001CGHN1/T1AGBWJ32-VFQFN Exposed PadA7001CMHN1/T1AGB39 illustrationA7001CMHN1/T1AGB39-A7001CMHN1/T1AGCEL illustrationA7001CMHN1/T1AGCEL-
Filter this family → · Selection resources · Upload your BOM